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Potato Wafer Machine

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MOQ : 1 Unit

Potato Wafer Machine Specification

Machine Type
Wafer Slicer

Noise Level
Low

Operating Temperature
Ambient

Phase
Single Phase

Function Type
Cutting/Slicing

Power Source
Electric

Speed Mode
Single Speed

Features
Stainless steel body, easy cleaning, efficient slicing

Feeding System
Manual

Frequency
50 Hz

Automation Grade
Semi-Automatic

Product Type
Waffer Cutting Machine

General Use
Potato wafer processing

Material
Stainless Steel

Type
Slicing Machine

Capacity
200-250 kg/hr

Weight (kg)
37 kg

Product Shape
Round (Wafer Slice)

Computerized
No

Automatic
Semi-Automatic

Control System
Manual

Installation Type
Table Top

Voltage
220 V

Power
0.5 HP

Dimension (L*W*H)
24 x 18 x 24 inches

Raw Material
Potato

Feature
High productivity

Color
Silver

Application
Snack food industry, small-scale and commercial kitchens

Finish
Mirror Polished

Usage/Application
For making potato chips, banana chips, and other vegetable slices

Maintenance
Low maintenance required

Output Thickness Range
0.8-2 mm (Adjustable)

Safety Features
Non-slip base, safety cover for blade

Motor Type
Copper Winding

Portability
Portable, easy to shift

Spare Parts Availability
Readily Available

Service Provided
On-site installation and training (if requested)

Blade Material
Food Grade Stainless Steel

Cleaning Method
Removable parts for easy cleaning

Potato Wafer Machine Trade Information

Minimum Order Quantity
1 Unit

Payment Terms
Cash in Advance (CID)

Supply Ability
10 Units Per Month

Delivery Time
5-7 Days

Main Domestic Market
All India

About Potato Wafer Machine

Discover the best-seller Potato Wafer Machine, an exclusive and in-demand solution for snack food producers. Crafted with an immaculate food-grade stainless steel blade and noble mirror finish, this semi-automatic machine blends efficiency and safety. Capable of slicing 200-250 kg/hr with adjustable thickness (0.8-2 mm), it features a copper-winding motor, non-slip base, and a safety blade cover-ensuring noteworthy protection and durability. Noteworthy for its portable design and easy-clean removable parts, this machine is tailored for commercial and small-scale kitchens. Enjoy on-site installation, training, readily available spare parts, and low maintenance with this remarkable wafer slicer.

Versatile Use and Advanced Features of the Potato Wafer Machine

Designed for both commercial and small-scale kitchens, the Potato Wafer Machine showcases exceptional features. Its stainless steel construction ensures durability, while the adjustable slicing thickness (0.8-2mm) and mirror polished finish set a high standard. The non-slip base and protective blade cover guarantee safety on any tabletop. Its semi-automatic operation and easy portability make it a valuable asset in the creation of potato chips, banana chips, and various vegetable slices.

Domestic Market Coverage and Hassle-Free Dispatching of the Potato Wafer Machine

The Potato Wafer Machine is highly favored across India's main domestic markets, guaranteeing reliable fulfillment. We facilitate seamless dispatching and prompt transportation through India's key FOB ports. Sample units are readily available for drop-off and demonstration upon request, ensuring complete satisfaction before bulk purchases. Our efficient logistics network ensures timely delivery and smooth handling of orders, prioritizing your convenience and peace of mind.

FAQ's of Potato Wafer Machine:

Q: How is the Potato Wafer Machine cleaned after use?

A: The Potato Wafer Machine features removable parts, allowing for easy cleaning after each use. Simply dismantle the components, wash them with mild detergent, and reassemble for your next operation.

Q: What types of vegetables can be sliced with this machine?

A: While ideal for potato and banana chips, the machine can also slice other vegetables, such as sweet potatoes and beetroot, as long as they fit the feeding size and meet the slicing criteria.

Q: Where can the Potato Wafer Machine be used?

A: This machine is perfect for commercial snack food operations, small-scale kitchens, restaurants, and catering businesses needing efficient, high-capacity slicing solutions.

Q: What safety features does this machine offer?

A: Noteworthy safety features include a non-slip base, protective blade cover, and a manual feeding system, minimizing the risk of accidents during operation.

Q: How is the thickness of the wafer slices adjusted?

A: Users can manually adjust the output thickness of wafer slices within the range of 0.8 to 2 mm, allowing perfect control over product texture and style.

Q: What is the purchasing process for sampling and installation?

A: Samples are available for clients to evaluate before bulk orders. Upon purchase, on-site installation and training can be requested to ensure seamless integration and operation in your facility.

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